Qualcomm Technologies has announced a multi-generation collaboration with Amazon to enable customised silicon at scale for large-scale AI data centres, working together on AI inference. In addition, the companies are working on optical connectivity solutions extending up to 1.6T and future-generation solutions.
As AI workloads grow exponentially – driving unprecedented demand for compute, storage, networking and memory bandwidth, and energy-efficient infrastructure – the collaboration brings together Amazon’s comprehensive, secure and price-performant AI infrastructure with Qualcomm Technologies’ leadership in power-efficient processing, silicon design and system-level integration.
Qualcomm Technologies and Amazon will also collaborate on high-performance optical connectivity solutions designed to support the growing scale and bandwidth demands of AI infrastructure. The collaboration will leverage Qualcomm Technologies’ advanced SerDes and optical DSP technologies.
As part of the expanded collaboration, Qualcomm Technologies plans to deepen its use of AWS AI infrastructure, including Amazon Bedrock, for electronic design automation (EDA) workloads, targeting a reduction in chip design cycles.
“As AI demand accelerates, data centre infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency,” said Cristiano Amon, President and CEO, Qualcomm Incorporated. “Qualcomm is pleased to work with AWS on customised silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure.”
